5g and data center will accelerate the deployment in China in 2020. The rapid application of 5g can not be achieved without the support of chips, from RF chips, baseband chips, vehicle chips to CPU chips. On June 15, the cooperation between Huawei automotive chip and BYD has begun. Huawei Kirin chip has taken the first step to expand the automotive market. The first product Kirin 710A has reached cooperation with BYD. Kirin chip is a mobile phone chip developed by Huawei Hisense Semiconductor Co., Ltd., and is currently only available to Huawei and glory mobile phones.
According to people close to Huawei's terminal company, the framework of this cooperation includes hicar, 5g module, digital car key and other products of Huawei and BYD. The cooperation between Kirin chip and BYD is not based on the business export of Huawei's intelligent automobile department, but the direct cooperation between Kirin's Hisilicon company and BYD.
According to the data, fullerene technology was established in December 2014. It is a joint-stock enterprise jointly invested and established by Changzhou sixth element materials technology Co., Ltd. and Jiangsu Huawei Century Electronics Group Co., Ltd., registered in Changzhou graphene science and Technology Industrial Park. It is a high-tech enterprise specializing in the research and development, production and sales of graphene thermal conductive film. The company's existing products include graphene thermal conductive film, graphene thermal conductive film, graphene foam film and so on.
It is understood that the graphene thermal conductive film independently developed by fullerene technology has already entered the supply chain system of Huawei and other domestic top mobile phone manufacturers. Huawei's new "graphene liquid cooling" solution developed by Huawei provides powerful heat dissipation function for its mobile phones, and fullerene technology is the material supplier of the scheme.